Invention Grant
- Patent Title: Memory array structure and method for forming the same
- Patent Title (中): 存储器阵列结构及其形成方法
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Application No.: US13576944Application Date: 2012-07-10
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Publication No.: US08541826B2Publication Date: 2013-09-24
- Inventor: Liyang Pan , Haozhi Ma
- Applicant: Liyang Pan , Haozhi Ma
- Applicant Address: CN Beijing
- Assignee: Tsinghua University
- Current Assignee: Tsinghua University
- Current Assignee Address: CN Beijing
- Agency: Houtteman Law LLC
- International Application: PCT/CN2012/078446 WO 20120710
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H01L21/8239

Abstract:
A memory array structure and a method for forming the same are provided. The memory array structure comprises: a substrate; a plurality of memory cells, each memory cell including a vertical transistor, of which a gate structure is formed in a first trench extending in a first direction; a plurality of word lines in the first direction, each word line formed in the first trench; a plurality of bit lines in a second direction, each bit line formed in lower sides of a semiconductor pillars; a plurality of body lines in the first direction, each body line having a first portion formed on the gate electrodes and a second portion covering a part of a top surface of semiconductor pillar for providing a substrate contact to vertical channel regions; and a plurality of data storage device contacts.
Public/Granted literature
- US20130161730A1 MEMORY ARRAY STRUCTURE AND METHOD FOR FORMING THE SAME Public/Granted day:2013-06-27
Information query
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