Invention Grant
- Patent Title: High frequency CMUT
- Patent Title (中): 高频CMUT
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Application No.: US13427856Application Date: 2012-03-22
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Publication No.: US08541853B1Publication Date: 2013-09-24
- Inventor: Steven Adler , Peter Johnson , Ira Oaktree Wygant
- Applicant: Steven Adler , Peter Johnson , Ira Oaktree Wygant
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Eugene C. Conser; W. James Brady; Frederick J. Telecky, Jr.
- Main IPC: H01L29/84
- IPC: H01L29/84

Abstract:
A high-frequency capacitive micromachined ultrasonic transducer (CMUT) has a silicon membrane and an overlying metal silicide layer that together form a conductive structure which can vibrate over a cavity. The CMUT also has a metal structure that touches a group of conductive structures. The metal structure has an opening that extends completely through the metal structure to expose the conductive structure.
Public/Granted literature
- US20130249023A1 High Frequency CMUT Public/Granted day:2013-09-26
Information query
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