Invention Grant
- Patent Title: Integrated three-dimensional module heat exchanger for power electronics cooling
- Patent Title (中): 用于电力电子冷却的集成三维模块热交换器
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Application No.: US13249706Application Date: 2011-09-30
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Publication No.: US08541875B2Publication Date: 2013-09-24
- Inventor: Kevin Bennion , Jason Lustbader
- Applicant: Kevin Bennion , Jason Lustbader
- Applicant Address: US CO Golden
- Assignee: Alliance for Sustainable Energy, LLC
- Current Assignee: Alliance for Sustainable Energy, LLC
- Current Assignee Address: US CO Golden
- Agent Paul J. White; John C. Stolpa
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/10
Abstract:
Embodiments discussed herein are directed to a power semiconductor packaging that removes heat from a semiconductor package through one or more cooling zones that are located in a laterally oriented position with respect to the semiconductor package. Additional embodiments are directed to circuit elements that are constructed from one or more modular power semiconductor packages.
Public/Granted literature
- US20130082377A1 INTEGRATED THREE-DIMENSIONAL MODULE HEAT EXCHANGER FOR POWER ELECTRONICS COOLING Public/Granted day:2013-04-04
Information query
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