Invention Grant
- Patent Title: Microelectronic package having direct contact heat spreader and method of manufacturing same
- Patent Title (中): 具有直接接触式散热器的微电子封装及其制造方法
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Application No.: US11242176Application Date: 2005-09-30
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Publication No.: US08541876B2Publication Date: 2013-09-24
- Inventor: Daoqiang Lu , Chuan Hu , Gilroy J. Vandentop , Shriram Ramanathan , Rajashree Baskaran , Valery M. Dubin
- Applicant: Daoqiang Lu , Chuan Hu , Gilroy J. Vandentop , Shriram Ramanathan , Rajashree Baskaran , Valery M. Dubin
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01L23/10
- IPC: H01L23/10
Abstract:
A method of fabricating a microelectronic package having a direct contact heat spreader, a package formed according to the method, a die-heat spreader combination formed according to the method, and a system incorporating the package. The method comprises metallizing a backside of a microelectronic die to form a heat spreader body directly contacting and fixed to the backside of the die thus yielding a die-heat spreader combination. The package includes the die-heat spreader combination and a substrate bonded to the die.
Public/Granted literature
- US20070075420A1 Microelectronic package having direct contact heat spreader and method of manufacturing same Public/Granted day:2007-04-05
Information query
IPC分类:
