Invention Grant
US08542309B2 Wafer-level lens array, method of manufacturing wafer-level lens array, lens module and imaging unit
有权
晶圆级透镜阵列,晶圆级透镜阵列的制造方法,透镜模块和成像单元
- Patent Title: Wafer-level lens array, method of manufacturing wafer-level lens array, lens module and imaging unit
- Patent Title (中): 晶圆级透镜阵列,晶圆级透镜阵列的制造方法,透镜模块和成像单元
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Application No.: US12880477Application Date: 2010-09-13
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Publication No.: US08542309B2Publication Date: 2013-09-24
- Inventor: Daisuke Yamada , Ryo Matsuno
- Applicant: Daisuke Yamada , Ryo Matsuno
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JPP2009-211853 20090914
- Main IPC: H04N5/225
- IPC: H04N5/225 ; G02B27/10 ; G02B3/00 ; B29D11/00

Abstract:
Disclosed are a wafer-level lens array, a method of manufacturing a wafer-level lens array, a lens module, and an imaging unit that can prevent the influence of, for example, the shrinkage of a forming material, prevent the positional deviation between lenses when the wafer-level lens arrays overlap each other or when the wafer-level lens array overlaps an imaging element array, and be easily designed.A method of manufacturing a wafer-level lens array including a substrate unit and a plurality of lens units that is arranged on the substrate unit includes: forming the substrate unit; and integrally forming the lens units that are made of a resin having substantially the same optical characteristics as a material forming the substrate unit with the substrate unit.
Public/Granted literature
- US20110063487A1 WAFER-LEVEL LENS ARRAY, METHOD OF MANUFACTURING WAFER-LEVEL LENS ARRAY, LENS MODULE AND IMAGING UNIT Public/Granted day:2011-03-17
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