Invention Grant
- Patent Title: Key assembly and electronic device using key assembly
- Patent Title (中): 钥匙组件和电子设备使用钥匙组件
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Application No.: US12904237Application Date: 2010-10-14
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Publication No.: US08542482B2Publication Date: 2013-09-24
- Inventor: Ming-Chun Hsiung
- Applicant: Ming-Chun Hsiung
- Applicant Address: HK Kowloon
- Assignee: FIH (Hong Kong) Limited
- Current Assignee: FIH (Hong Kong) Limited
- Current Assignee Address: HK Kowloon
- Agency: Altis Law Group, Inc.
- Priority: CN201010268113 20100831
- Main IPC: H05K7/00
- IPC: H05K7/00 ; G06F1/16
Abstract:
A key assembly includes a key member, the key member includes a main body and a securing portion extending from each end of the main body; and a pressing member for operating the key, the pressing member defines a receiving groove for receiving the main body.
Public/Granted literature
- US20120050962A1 KEY ASSEMBLY AND ELECTRONIC DEVICE USING KEY ASSEMBLY Public/Granted day:2012-03-01
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