Invention Grant
- Patent Title: Connection and addressing of multi-plane crosspoint devices
- Patent Title (中): 多平面交叉点设备的连接和寻址
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Application No.: US13384872Application Date: 2010-04-30
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Publication No.: US08542515B2Publication Date: 2013-09-24
- Inventor: Frederick Perner
- Applicant: Frederick Perner
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- International Application: PCT/US2010/033141 WO 20100430
- International Announcement: WO2011/136795 WO 20111103
- Main IPC: G11C5/06
- IPC: G11C5/06

Abstract:
A multi-plane circuit structure has at least a first circuit plane and a second circuit plane, and each circuit plane has a plurality of row wire segments, a plurality of column wire segments, and a plurality of crosspoint devices formed at intersections of the row wire segments and the column wire segments. The row and column wire segments have a segment length for forming a preselected number of crosspoint devices thereon. Each row wire segment in the second circuit plane is connected to a row wire segment in the first circuit plane with no offset in a row direction and in a column direction, and each column wire segment in the second circuit plane is connected to a column wire segment in the first circuit plane with an offset length in both the row direction and the column direction. The offset length corresponds to half of the preselected number of crosspoint devices.
Public/Granted literature
- US20130039111A1 CONNECTION AND ADDRESSING OF MULTI-PLANE CROSSPOINT DEVICES Public/Granted day:2013-02-14
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