A package for dissipating heat power and/or optical power from an optical fiber component of a device is provided. The package includes a heat sink packaging receptacle for accommodating the optical fiber component having a cavity for receiving a temperature sensitive portion of the optical fiber component. According to one aspect, the package may include a power-dissipative material for dissipating heat power or optical power, the power-dissipative material extending within the cavity and surrounding the temperature-sensitive portion of the optical fiber component. According to another aspect, the package may include at least one channel extending between the cavity and an end of the heat sink packaging receptacle, the channel being in intimate contact with the cladding of the optical fiber component for dissipating heat power and/or optical power from the optical fiber component.