Invention Grant
US08543878B1 Apparatus and a method to test a parametric structure utilizing logical sensing
有权
使用逻辑检测来测试参数结构的装置和方法
- Patent Title: Apparatus and a method to test a parametric structure utilizing logical sensing
- Patent Title (中): 使用逻辑检测来测试参数结构的装置和方法
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Application No.: US13284830Application Date: 2011-10-28
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Publication No.: US08543878B1Publication Date: 2013-09-24
- Inventor: Eng Ling Ho , Chai Ling Chee
- Applicant: Eng Ling Ho , Chai Ling Chee
- Applicant Address: US CA San Jose
- Assignee: Altera Corporation
- Current Assignee: Altera Corporation
- Current Assignee Address: US CA San Jose
- Agency: Womble Carlyle Sandridge & Rice, LLP
- Main IPC: G01R31/28
- IPC: G01R31/28

Abstract:
An apparatus to test a parametric structure utilizing a logical sensing technique is provided. The apparatus includes a device under test (DUT) and tester hardware. The DUT includes a parametric structure that receives a logic signal and transfers the logic signal through the parametric structure to a power pin that is coupled to the parametric structure. The DUT also includes a DFT circuitry that controls a pathway connecting the parametric structure and the power pin. The DFT circuitry gates the logic signal propagation from the parametric structure to the power pin. The tester hardware includes a channel to transfer or receive a logic signal and a power pathway to transfer power to the DUT. The tester hardware also includes a switch to multiplex the power pathway or the channel connections to the power pin.
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