Invention Grant
- Patent Title: Bendable electronic interface external control system and method
- Patent Title (中): 可弯曲电子接口外部控制系统及方法
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Application No.: US12583595Application Date: 2009-08-21
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Publication No.: US08544722B2Publication Date: 2013-10-01
- Inventor: Alexander J. Cohen , Edward K. Y. Jung , Royce A. Levien , Richard T. Lord , Robert W. Lord , Mark A. Malamud , John D. Rinaldo, Jr.
- Applicant: Alexander J. Cohen , Edward K. Y. Jung , Royce A. Levien , Richard T. Lord , Robert W. Lord , Mark A. Malamud , John D. Rinaldo, Jr.
- Applicant Address: US WA Bellevue
- Assignee: The Invention Science Fund I, LLC
- Current Assignee: The Invention Science Fund I, LLC
- Current Assignee Address: US WA Bellevue
- Main IPC: G06K7/10
- IPC: G06K7/10
Abstract:
A method includes, but is not limited to: obtaining first information regarding one or more positions of one or more portions of one or more regions of a bendable electronic interface and sending one or more application related information portions to the bendable electronic interface based upon the obtaining of the first information. In addition to the foregoing, other related method/system aspects are described in the claims, drawings, and text forming a part of the present disclosure.
Public/Granted literature
- US20100085300A1 Bendable electronic interface external control system and method Public/Granted day:2010-04-08
Information query
