Invention Grant
- Patent Title: Wireless IC device, wireless IC module and method of manufacturing wireless IC module
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Application No.: US13688287Application Date: 2012-11-29
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Publication No.: US08544759B2Publication Date: 2013-10-01
- Inventor: Noboru Kato
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing., Ltd.
- Current Assignee: Murata Manufacturing., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2009-003315 20090109; JP2009-019695 20090130; JP2009-210723 20090911
- Main IPC: G06K19/06
- IPC: G06K19/06

Abstract:
A wireless IC module that can function as a component of an RFID system even when mounted on a metal article includes a loop-shaped electrode that is constructed such that a plane of a loop of the loop-shaped electrode is substantially perpendicular to the mounting surface of a wireless IC module. The loop-shaped electrode functions as a magnetic field antenna and is electromagnetically coupled with a metal article so that the surface of the metal article functions as a radiator antenna.
Public/Granted literature
- US20130087625A1 WIRELESS IC DEVICE, WIRELESS IC MODULE AND METHOD OF MANUFACTURING WIRELESS IC MODULE Public/Granted day:2013-04-11
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