Invention Grant
- Patent Title: Lighting apparatus with heat conductive substrate
- Patent Title (中): 带导热基板的照明装置
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Application No.: US13590804Application Date: 2012-08-21
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Publication No.: US08545051B2Publication Date: 2013-10-01
- Inventor: Takayoshi Moriyama , Kazunari Higuchi , Sumio Hashimoto , Shinichi Kumashiro
- Applicant: Takayoshi Moriyama , Kazunari Higuchi , Sumio Hashimoto , Shinichi Kumashiro
- Applicant Address: JP Yokosuka-shi, Kanagawa JP Minato-ku, Tokyo
- Assignee: Toshiba Lighting & Technology Corporation,Kabushiki Kaisha Toshiba
- Current Assignee: Toshiba Lighting & Technology Corporation,Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Yokosuka-shi, Kanagawa JP Minato-ku, Tokyo
- Agency: Banner & Witcoff, Ltd.
- Priority: JP2008-142063 20080530; JP2009-071276 20090324
- Main IPC: F21S4/00
- IPC: F21S4/00 ; H05K1/05

Abstract:
A substrate for a lighting apparatus includes one or more light-emitting elements mounted thereon. The substrate includes a surface on which the plurality of light-emitting elements are mounted. Additionally, the substrate includes heat conductive elements for conducting heat from the one or more light-emitting elements, the heat conductive elements including heat conductive holes extending through a non-electrically conducting layer formed on a first surface of the substrate and an entirety of the substrate and a heat conductive layer formed on a surface of the substrate opposite the first surface.
Public/Granted literature
- US20120314432A1 Lighting Apparatus and Light-Emitting Element Substrate Having Stress Absorbing Means Public/Granted day:2012-12-13
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