Invention Grant
- Patent Title: Substrate transfer apparatus and substrate transfer method
- Patent Title (中): 基板转印装置和基板转印方法
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Application No.: US12715497Application Date: 2010-03-02
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Publication No.: US08545160B2Publication Date: 2013-10-01
- Inventor: Hiromitsu Sakaue , Hirofumi Yamaguchi
- Applicant: Hiromitsu Sakaue , Hirofumi Yamaguchi
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JP2009-049118 20090303
- Main IPC: H01L21/677
- IPC: H01L21/677

Abstract:
A substrate transfer apparatus that transfers a substrate with respect to a processing apparatus includes a substrate accommodation unit for accommodating a plurality of substrates to be loaded into the processing apparatus in a vertical direction in a multi-stage; a substrate accommodation unit for accommodating a plurality of substrates unloaded from the processing apparatus in a vertical direction in a multi-stage; a substrate holder for transferring the substrates from the substrate accommodation unit to the processing apparatus; a substrate holder for transferring the substrates from the processing apparatus to the substrate accommodation unit. The substrate accommodation unit has an elevating mechanism for moving at least one of the substrate and the substrate holder in a vertical direction relative to each other and the substrate accommodation unit has an elevating mechanism for moving at least one of the substrate and the substrate holder in a vertical direction relative to each other.
Public/Granted literature
- US20100226737A1 SUBSTRATE TRANSFER APPARATUS AND SUBSTRATE TRANSFER METHOD Public/Granted day:2010-09-09
Information query
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