Invention Grant
- Patent Title: Label manufacturing method and label manufacturing apparatus
- Patent Title (中): 标签制造方法和标签制造装置
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Application No.: US12386845Application Date: 2009-04-23
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Publication No.: US08545217B2Publication Date: 2013-10-01
- Inventor: Tatsuya Obuchi
- Applicant: Tatsuya Obuchi
- Applicant Address: JP
- Assignee: Seiko Instruments Inc.
- Current Assignee: Seiko Instruments Inc.
- Current Assignee Address: JP
- Agency: Adams & Wilks
- Priority: JP2008-113649 20080424
- Main IPC: F27B9/40
- IPC: F27B9/40

Abstract:
A label manufacturing apparatus has a thermal head with heating elements for heating at least a part of a heat sensitive adhesive sheet to place it into an adhesive state when the heat sensitive sheet is transported through a preselected position of the label manufacturing apparatus in which the heat sensitive sheet contacts the heating elements of the thermal head. A control device selectively operates the heating elements of the thermal head in synchronization with timing of transporting of the heat sensitive adhesive sheet through the preselected position to thereby heat the part of the heat sensitive adhesive sheet and place into the adhesive state, and stops operation of the heating elements so that a trailing end portion of the heat sensitive sheet is not heated and is not placed into an adhesive state when the trailing end portion reaches the preselected position.
Public/Granted literature
- US20100304319A1 Label manufacturing method and label manufacturing apparatus Public/Granted day:2010-12-02
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