Invention Grant
US08545770B2 Method for improving the bonding properties of microstructured substrates, and devices prepared with this method
失效
用于改善微结构基材的粘合性能的方法，以及用该方法制备的装置
- Patent Title: Method for improving the bonding properties of microstructured substrates, and devices prepared with this method
- Patent Title (中): 用于改善微结构基材的粘合性能的方法，以及用该方法制备的装置
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Application No.: US12448169Application Date: 2007-12-11
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Publication No.: US08545770B2Publication Date: 2013-10-01
- Inventor: Jean-Louis Viovy , Jeremie Weber , Debjani Paul , Laurent Malaquin , Sandrine Miserere
- Applicant: Jean-Louis Viovy , Jeremie Weber , Debjani Paul , Laurent Malaquin , Sandrine Miserere
- Applicant Address: FR Paris FR Paris FR Paris
- Assignee: Institue Curie,Centre Nationale de Recherche Scientifique,Fluigent Paris-Biotech-Faculte de Medecine
- Current Assignee: Institue Curie,Centre Nationale de Recherche Scientifique,Fluigent Paris-Biotech-Faculte de Medecine
- Current Assignee Address: FR Paris FR Paris FR Paris
- Agency: Oliff & Berridge, PLC
- International Application: PCT/IB2007/055031 WO 20071211
- International Announcement: WO2008/072187 WO 20080619
- Main IPC: B01L3/00
- IPC: B01L3/00
Abstract:
A method for treating the surface of a polymerio substrate, including the following steps: providing a first polymeric substrate; contracting at least one part of one face of the first substrate with some liquid solvent system, the liquid solvent system containing at least a first volatile compound and at least a second compound having a low molecular weight and able to swell and/or soften the polymeric material forming the face; letting at least the volatile compound to evaporate from the face of the first substrate and; contracting the so-treated face of first substrate with a third material.
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