Invention Grant
US08545987B2 Thermal interface material with thin transfer film or metallization
有权
热界面材料具有薄的转移膜或金属化
- Patent Title: Thermal interface material with thin transfer film or metallization
- Patent Title (中): 热界面材料具有薄的转移膜或金属化
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Application No.: US11938588Application Date: 2007-11-12
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Publication No.: US08545987B2Publication Date: 2013-10-01
- Inventor: Jason Strader , Mark Wisniewski
- Applicant: Jason Strader , Mark Wisniewski
- Applicant Address: US MO Earth City
- Assignee: Laird Technologies, Inc.
- Current Assignee: Laird Technologies, Inc.
- Current Assignee Address: US MO Earth City
- Agency: Harness, Dickey & Pierce, P.L.C.
- Main IPC: B32B15/06
- IPC: B32B15/06 ; B32B15/08 ; B32B7/06 ; B32B27/20 ; H01L23/34 ; H01L23/36
Abstract:
According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a metallization layer having a layer thickness of about 0.0005 inches or less. The metallization layer is disposed along at least a portion of the first side of the thermal interface material.
Public/Granted literature
- US20090117373A1 THERMAL INTERFACE MATERIAL WITH THIN TRANSFER FILM OR METALLIZATION Public/Granted day:2009-05-07
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