Invention Grant
- Patent Title: Electrodeposited metallic materials comprising cobalt
- Patent Title (中): 包含钴的电沉积金属材料
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Application No.: US12785520Application Date: 2010-05-24
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Publication No.: US08545994B2Publication Date: 2013-10-01
- Inventor: Diana Facchini , Francisco Gonzalez , Jonathan McCrea , Mike Uetz , Gino Palumbo , Klaus Tomantschger , Nandakumar Nagarajan , Jared J. Victor , Uwe Erb
- Applicant: Diana Facchini , Francisco Gonzalez , Jonathan McCrea , Mike Uetz , Gino Palumbo , Klaus Tomantschger , Nandakumar Nagarajan , Jared J. Victor , Uwe Erb
- Applicant Address: CA Ontario
- Assignee: Integran Technologies Inc.
- Current Assignee: Integran Technologies Inc.
- Current Assignee Address: CA Ontario
- Agency: Rankin Hill & Clark LLP
- Main IPC: B32B3/02
- IPC: B32B3/02 ; B32B15/04 ; C22C19/07 ; C25D5/48 ; C25D3/12

Abstract:
An article includes an electrodeposited metallic material including Co with a minimum content of 75% by weight. The metallic material has a microstructure which is fine-grained with an average grain size between 2 and 5,000 nm and/or an amorphous microstructure. The metallic material forms at least part of an exposed surface of the article. The metallic material has an inherent contact angle for water of less than 90 degrees at room temperature when measured on a smooth exposed surface portion of the metallic material which has a maximum surface roughness Ra of 0.25 microns. The metallic material has an exposed patterned surface portion having surface structures having a height of between at least 5 microns to about 100 microns incorporated therein to increase the contact angle for water at room temperature of the exposed patterned surface portion to over 100 degrees.
Public/Granted literature
- US20100304179A1 ELECTRODEPOSITED METALLIC MATERIALS COMPRISING COBALT Public/Granted day:2010-12-02
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