Invention Grant
US08546184B2 Package substrate having die pad with outer raised portion and interior recessed portion
有权
封装基板，具有具有外部凸起部分和内部凹陷部分的管芯焊盘
- Patent Title: Package substrate having die pad with outer raised portion and interior recessed portion
- Patent Title (中): 封装基板，具有具有外部凸起部分和内部凹陷部分的管芯焊盘
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Application No.: US13734239Application Date: 2013-01-04
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Publication No.: US08546184B2Publication Date: 2013-10-01
- Inventor: Chih-Chien Ho , Saihsi Jen , Eric Hsieh
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Steven A. Shaw; W. James Brady; Frederick J. Telecky, Jr.
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method of forming an electronic assembly includes dispensing a die attach material on a substrate into a recessed portion that includes an inner recessed portion of including a die pad. The die attach material is not dispensed on an outer raised flat portion of the die pad. A semiconductor die is attached directly on the outer raised flat portion and affixed to the die pad with said die attach material in said interior recessed portion but not on said outer raised flat portion.
Public/Granted literature
- US20130122654A1 Package Substrate Having Die Pad with Outer Raised Portion and Interior Recessed Portion Public/Granted day:2013-05-16
Information query
IPC分类:
