Hybrid gap-fill approach for STI formation

Invention Grant

US08546242B2 Hybrid gap-fill approach for STI formation 有权

Title translation: 混合间隙填充方法用于STI形成

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Patent Title: Hybrid gap-fill approach for STI formation
Patent Title (中): 混合间隙填充方法用于STI形成
Application No.: US13481526

Application Date: 2012-05-25
Publication No.: US08546242B2

Publication Date: 2013-10-01
Inventor: Neng-Kuo Chen , Chih-Hsiang Chang , Kuo-Hwa Tzeng , Cheng-Yuan Tsai
Applicant: Neng-Kuo Chen , Chih-Hsiang Chang , Kuo-Hwa Tzeng , Cheng-Yuan Tsai
Applicant Address: TW Hsin-Chu
Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
Current Assignee Address: TW Hsin-Chu
Agency: Slater & Matsil, L.L.P.
Main IPC: H01L21/8238
IPC: H01L21/8238

Hybrid gap-fill approach for STI formation

Abstract:

A method of forming a shallow trench isolation region is provided. The method includes providing a semiconductor substrate comprising a top surface; forming an opening extending from the top surface into the semiconductor substrate; performing a conformal deposition method to fill a dielectric material into the opening; performing a first treatment on the dielectric material, wherein the first treatment provides an energy high enough for breaking bonds in the dielectric material; and performing a steam anneal on the dielectric material.

Abstract(Chinese):

提供了形成浅沟槽隔离区域的方法。该方法包括提供包括顶表面的半导体衬底; 形成从所述顶表面延伸到所述半导体衬底中的开口; 执行保形沉积方法以将电介质材料填充到开口中; 对所述电介质材料进行第一处理，其中所述第一处理提供足够高的能量以破坏所述电介质材料中的键; 并对介电材料进行蒸汽退火。

Public/Granted literature

US20120235273A1 Hybrid Gap-fill Approach for STI Formation Public/Granted day:2012-09-20

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/70	.由在一共用基片内或其上形成的多个固态组件或集成电路组成的器件或其部件的制造或处理；集成电路器件或其特殊部件的制造（由预制电组件组成的组装件的制造入H05K3/00，H05K13/00）
H01L21/77	..在公共衬底中或上面形成的由许多固态元件或集成电路组成的器件的制造或处理（电可编程只读存储器或其多步骤的制造方法入H01L27/115）
H01L21/78	...把衬底连续地分成多个独立的器件（改变表面物理特性或者半导体形状的切割入H01L21/304）
H01L21/82	....制造器件，例如每一个由许多元件组成的集成电路
H01L21/822	.....衬底是采用硅工艺的半导体的（H01L21/8258优先）
H01L21/8232	......场效应工艺
H01L21/8234	.......MIS工艺
H01L21/8238	........互补场效应晶体管，例如CMOS