Invention Grant
- Patent Title: Fabric containing non-crimped fibers and methods of manufacture
- Patent Title (中): 含有非卷曲纤维的织物及其制造方法
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Application No.: US13062312Application Date: 2009-09-03
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Publication No.: US08546260B2Publication Date: 2013-10-01
- Inventor: Oscar K. Hsu , Paul Lefevre
- Applicant: Oscar K. Hsu , Paul Lefevre
- Applicant Address: US MA Wilmington
- Assignee: Innopad, Inc.
- Current Assignee: Innopad, Inc.
- Current Assignee Address: US MA Wilmington
- Agency: Grossman, Tucker, Perreault & Pfleger, PLLC
- International Application: PCT/US2009/055896 WO 20090903
- International Announcement: WO2010/028154 WO 20100311
- Main IPC: H01L21/302
- IPC: H01L21/302 ; H01L21/461
Abstract:
A chemical-mechanical planarization pad for semiconductor manufacturing is provided. The pad comprises synthetic fibers that are non-crimped fibers which are present in an amount of 1.0% by weight to 98.0% by weight in the mat and wherein the non-crimped fibers have a length of 0.1 cm to 127 cm and a diameter of 1.0 to 1000 micrometers.
Public/Granted literature
- US20110171831A1 FABRIC CONTAINING NON-CRIMPED FIBERS AND METHODS OF MANUFACTURE Public/Granted day:2011-07-14
Information query
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