Invention Grant
- Patent Title: Slurry for polishing and planarization method of insulating layer using the same
- Patent Title (中): 浆料用于抛光和平面化方法的绝缘层使用
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Application No.: US13034345Application Date: 2011-02-24
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Publication No.: US08546261B2Publication Date: 2013-10-01
- Inventor: Sangkyun Kim , NamSoo Kim , JongWoo Kim , Yun-Jeong Kim
- Applicant: Sangkyun Kim , NamSoo Kim , JongWoo Kim , Yun-Jeong Kim
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Onello & Mello, LLP
- Priority: KR10-2010-0017283 20100225
- Main IPC: H01L21/302
- IPC: H01L21/302
Abstract:
A polishing slurry includes an abrasive, a dispersion agent, a polish accelerating agent and an adhesion inhibitor. The adhesion inhibitor includes a benzene compound combined with a carboxyl group. Methods of planarizing an insulating layer using the slurry are also provided.
Public/Granted literature
- US20110207326A1 SLURRY FOR POLISHING AND PLANARIZATION METHOD OF INSULATING LAYER USING THE SAME Public/Granted day:2011-08-25
Information query
IPC分类:
