Invention Grant
- Patent Title: Solid-state image pickup device, method of manufacturing the same and electronic apparatus
- Patent Title (中): 固体摄像装置及其制造方法以及电子装置
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Application No.: US13523417Application Date: 2012-06-14
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Publication No.: US08546262B2Publication Date: 2013-10-01
- Inventor: Akiko Ogino , Yukihiro Sayama , Takayuki Shoya , Masaya Shimoji
- Applicant: Akiko Ogino , Yukihiro Sayama , Takayuki Shoya , Masaya Shimoji
- Applicant Address: JP
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP
- Agency: Sheridan Ross P.C.
- Priority: JP2009-129784 20090529
- Main IPC: H01L21/311
- IPC: H01L21/311

Abstract:
Disclosed herein is a solid-state image pickup device including: a trench formed in an insulating film above a light-receiving portion; a first waveguide core portion provided on an inner wall side of the trench; a second waveguide core portion filled in the trench via the first waveguide core portion; and a rectangular lens formed of the same material as that of the second waveguide core portion and provided integrally with the second waveguide core portion.
Public/Granted literature
- US20120258563A1 SOLID-STATE IMAGE PICKUP DEVICE, METHOD OF MANUFACTURING THE SAME AND ELECTRONIC APPARATUS Public/Granted day:2012-10-11
Information query
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