Invention Grant
US08546267B2 Method of processing a workpiece in a plasma reactor using multiple zone feed forward thermal control
有权
使用多区域前馈热控制在等离子体反应器中处理工件的方法
- Patent Title: Method of processing a workpiece in a plasma reactor using multiple zone feed forward thermal control
- Patent Title (中): 使用多区域前馈热控制在等离子体反应器中处理工件的方法
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Application No.: US12953793Application Date: 2010-11-24
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Publication No.: US08546267B2Publication Date: 2013-10-01
- Inventor: Paul Lukas Brillhart , Richard Fovell , Douglas A. Buchberger, Jr. , Douglas H. Burns , Kallol Bera , Daniel J. Hoffman , Kenneth W. Cowans , William W. Cowans , Glenn W. Zubillaga , Isaac Millan
- Applicant: Paul Lukas Brillhart , Richard Fovell , Douglas A. Buchberger, Jr. , Douglas H. Burns , Kallol Bera , Daniel J. Hoffman , Kenneth W. Cowans , William W. Cowans , Glenn W. Zubillaga , Isaac Millan
- Applicant Address: US FL Wellington US CA Santa Clara
- Assignee: B/E Aerospace, Inc.,Applied Materials, Inc.
- Current Assignee: B/E Aerospace, Inc.,Applied Materials, Inc.
- Current Assignee Address: US FL Wellington US CA Santa Clara
- Agency: Knobbe Martens Olson & Bear LLP
- Main IPC: G01L19/04
- IPC: G01L19/04
Abstract:
A method of controlling wafer temperature in a plasma reactor by obtaining the next scheduled change in RF heat load on the workpiece, and using thermal modeling to estimate respective changes in wafer backside gas pressure and in coolant flow through a wafer support pedestal that would compensate for the next scheduled change in RF heat load, and making the respective changes in the backside gas pressure or in the coolant flow prior to the time of the next scheduled change.
Public/Granted literature
- US20110068085A1 METHOD OF PROCESSING A WORKPIECE IN A PLASMA REACTOR USING MULTIPLE ZONE FEED FORWARD THERMAL CONTROL Public/Granted day:2011-03-24
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