Invention Grant
- Patent Title: Photocurable dicing die bonding tape
- Patent Title (中): 光固化切割片粘合胶带
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Application No.: US13785488Application Date: 2013-03-05
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Publication No.: US08546485B2Publication Date: 2013-10-01
- Inventor: Byoungchul Lee , Pauline Chiang , Kevin Harris Becker
- Applicant: Henkel Corporation
- Applicant Address: US CT Rocky Hill
- Assignee: Henkel Corporation
- Current Assignee: Henkel Corporation
- Current Assignee Address: US CT Rocky Hill
- Agent Sun Hee Lehmann
- Main IPC: C09J175/06
- IPC: C09J175/06 ; C09J183/04 ; C09J133/08

Abstract:
A pressure sensitive adhesive comprising (A) pressure sensitive adhesive polymers having pendant carbon-carbon unsaturation and (B) hydrophobic polymers terminated with carbon-carbon unsaturation. In one embodiment the hydrophobic polymers are vinyl terminated polydimethoxyl siloxane polymers and/or vinyl terminated fluoropolymers reduces the interaction of the pressure sensitive adhesive with adherends and provides excellent release of the pressure sensitive adhesive after cure.
Public/Granted literature
- US20130178585A1 PHOTOCURABLE DICING DIE BONDING TAPE Public/Granted day:2013-07-11
Information query
IPC分类: