Invention Grant
- Patent Title: Printed circuit board and method for manufacturing the same
- Patent Title (中): 印刷电路板及其制造方法
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Application No.: US12820605Application Date: 2010-06-22
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Publication No.: US08546696B2Publication Date: 2013-10-01
- Inventor: Hirohito Watanabe
- Applicant: Hirohito Watanabe
- Applicant Address: JP Tokyo
- Assignee: Fujikura Ltd.
- Current Assignee: Fujikura Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2009-148510 20090623
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K3/00 ; H01R9/00

Abstract:
A printed circuit board having a connection terminal which includes: an insulating substrate including first and second surfaces, and an end surface along an outline normal to an insertion direction of the connection terminal; at least one lead wiring layer formed on the first surface of the insulating substrate; an insulating protection film covering the lead wiring layer; at least one lead terminal layer constituting an end portion of the lead wiring layer, the lead terminal layer being formed into a strip, and having an end surface along the outline; a reinforcement body adhered on the second surface of the insulating substrate at a backside position of the lead terminal layer; wherein a distance between an outer surface of the lead terminal layer and an outer surface of the reinforcement body on the outline side is smaller than a distance therebetween on the lead wiring layer side.
Public/Granted literature
- US20100319972A1 PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2010-12-23
Information query