Invention Grant
US08546700B2 Capacitor for incorporation in wiring board, wiring board, method of manufacturing wiring board, and ceramic chip for embedment
有权
用于布线板的电容器,布线板,制造布线板的方法和用于嵌入的陶瓷芯片
- Patent Title: Capacitor for incorporation in wiring board, wiring board, method of manufacturing wiring board, and ceramic chip for embedment
- Patent Title (中): 用于布线板的电容器,布线板,制造布线板的方法和用于嵌入的陶瓷芯片
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Application No.: US13042686Application Date: 2011-03-08
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Publication No.: US08546700B2Publication Date: 2013-10-01
- Inventor: Hiroshi Yamamoto , Toshitake Seki , Shinji Yuri , Masaki Muramatsu , Motohiko Sato , Kazuhiro Hayashi , Jun Otsuka , Manabu Sato
- Applicant: Hiroshi Yamamoto , Toshitake Seki , Shinji Yuri , Masaki Muramatsu , Motohiko Sato , Kazuhiro Hayashi , Jun Otsuka , Manabu Sato
- Applicant Address: JP Aichi
- Assignee: NGK Spark Plug Co., Ltd.
- Current Assignee: NGK Spark Plug Co., Ltd.
- Current Assignee Address: JP Aichi
- Agency: Sughrue Mion, PLLC
- Priority: JP2005-228936 20050805; JP2005-228937 20050805; JP2005-267592 20050914; JP2006-145724 20060525; JP2006-145725 20060525
- Main IPC: H05K1/16
- IPC: H05K1/16

Abstract:
A capacitor comprising: a capacitor body including a plurality of laminated dielectric layers, a plurality of inner electrode layers which are respectively disposed between mutually adjacent ones of the dielectric layers, a first main surface located in a laminated direction of the dielectric layers, and a second main surface opposite to the first main surface; a first outer electrode formed on the first main surface of the capacitor body and electrically connected to the inner electrode layers; a second outer electrode formed on the second main surface of the capacitor body and electrically connected to the inner electrode layers; a first dummy electrode formed on the first main surface of the capacitor body; and a second dummy electrode formed on the second main surface of the capacitor body.
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