Invention Grant
- Patent Title: Semiconductor device, method of manufacturing the same, and method of forming multilayer semiconductor thin film
- Patent Title (中): 半导体装置及其制造方法以及多层半导体薄膜的形成方法
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Application No.: US13771846Application Date: 2013-02-20
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Publication No.: US08546796B2Publication Date: 2013-10-01
- Inventor: Norihito Kobayashi , Mari Sasaki , Takahiro Ohe
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Dentons US LLP
- Main IPC: H01L51/30
- IPC: H01L51/30

Abstract:
A semiconductor device including a gate electrode, a gate insulating layer, source/drain electrodes, and a channel-forming region that are disposed on a base is provided. The method includes the steps of forming a thin film by application of a mixed solution including a polymeric insulating material and a dioxaanthanthrene compound represented by structural formula (1) below; and subsequently drying the thin film to induce phase separation of the polymeric insulating material and the dioxaanthanthrene compound, thereby forming the gate insulating layer from the polymeric insulating material and the channel-forming region from the dioxaanthanthrene compound: wherein at least one of R3 and R9 represents a substituent other than hydrogen.
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