Invention Grant
- Patent Title: Zinc oxide based compound semiconductor device
- Patent Title (中): 氧化锌基化合物半导体器件
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Application No.: US12907127Application Date: 2010-10-19
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Publication No.: US08546797B2Publication Date: 2013-10-01
- Inventor: Tomofumi Yamamuro , Hiroyuki Kato , Akio Ogawa
- Applicant: Tomofumi Yamamuro , Hiroyuki Kato , Akio Ogawa
- Applicant Address: JP Tokyo
- Assignee: Stanley Electric Co., Ltd.
- Current Assignee: Stanley Electric Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz, Goodman & Chick, PC
- Priority: JP2009-241081 20091020; JP2009-250540 20091030
- Main IPC: H01L29/12
- IPC: H01L29/12 ; H01L21/00

Abstract:
In a ZnO based compound semiconductor device, nitrogen (N) doped (Mg)ZnO:N layer is inserted as a diffusion barrier layer 9 between a ZnO based n-type layer 3 to which n-type dopants are doped and an active layer 4 or a p-type layer 5. The diffusion barrier layer 9 prevents diffusion of the n-type dopants to the active layer 4 or the p-type layer 5. Crystalline quality of the active layer 4 of the ZnO based compound semiconductor device is not deteriorated by the diffusion of the n-type dopants.
Public/Granted literature
- US20110089418A1 ZINC OXIDE BASED COMPOUND SEMICONDUCTOR DEVICE Public/Granted day:2011-04-21
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