Invention Grant
- Patent Title: Light-emitting module and method of manufacture for a light-emitting module
- Patent Title (中): 发光模块及其制造方法
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Application No.: US12529137Application Date: 2008-02-29
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Publication No.: US08546826B2Publication Date: 2013-10-01
- Inventor: Jan Marfeld , Walter Wegleiter , Moritz Engl
- Applicant: Jan Marfeld , Walter Wegleiter , Moritz Engl
- Applicant Address: DE Regensburg
- Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee Address: DE Regensburg
- Agency: Slater & Matsil, L.L.P.
- Priority: DE102007011123 20070307
- International Application: PCT/DE2008/000363 WO 20080229
- International Announcement: WO2008/106941 WO 20080912
- Main IPC: H01L33/00
- IPC: H01L33/00
Abstract:
A light-emitting module includes a supporting element, a number of optoelectronic semiconductor components mounted on the supporting element for the generation of electromagnetic radiation, and a metallic connecting layer by means of which the optoelectronic semiconductor components are supplied with operating voltage. An insulation layer is arranged in a region of the optoelectronic semiconductor components between the supporting element and the metallic connecting layer. The metallic connecting layer forms a light shade for the optoelectronic semiconductor components, so that the electromagnetic radiation is only emitted in a specified direction.
Public/Granted literature
- US20100117103A1 Light-Emitting Module and Method of Manufacture for a Light-Emitting Module Public/Granted day:2010-05-13
Information query
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