A light emitting device uses a conductive bonding agent in bonding a package and a cap, and the light emitting device is a non-air tight and can be manufactured stably, with an improved yield. A method of manufacturing the light emitting device includes a step of bonding a cap having a frame portion to a package having a light emitting element mounted in a recess of the package to cover an opening of the recess. In the step of bonding, a metal bonding agent having greater wettability to the frame portion than to the package is partially disposed to the package or the frame portion, and extended along the frame portion so that ends of the metal bonding agent are joined to each other. With this, a space is defined at a joining portion where the ends of the metal bonding agent are joined, and the package and the frame portion are bonded.