Invention Grant
- Patent Title: Hybrid multilayer substrate
- Patent Title (中): 混合多层基板
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Application No.: US12862068Application Date: 2010-08-24
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Publication No.: US08546921B2Publication Date: 2013-10-01
- Inventor: Vivek Ramadoss , Gopal C. Jha , Christopher J. Healy
- Applicant: Vivek Ramadoss , Gopal C. Jha , Christopher J. Healy
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agent Michelle Gallardo
- Main IPC: H01L23/552
- IPC: H01L23/552
Abstract:
A hybrid multilayer substrate in an electronic package. The substrate includes a first portion having m layers and a second portion having n layers such that m is less than n. The first portion has a first height and the second portion has a second height. The first height is different than the second height. In another embodiment, a surface is formed between the first portion and the second portion, and a shielding material can be applied to the surface. In a different embodiment, the hybrid multilayer substrate is manufactured for shielding a first die from a second die.
Public/Granted literature
- US20120049333A1 Hybrid Multilayer Substrate Public/Granted day:2012-03-01
Information query
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