Invention Grant
US08546925B2 Synchronous buck converter having coplanar array of contact bumps of equal volume
有权
同步降压转换器具有同等体积的接触凸块的共面阵列
- Patent Title: Synchronous buck converter having coplanar array of contact bumps of equal volume
- Patent Title (中): 同步降压转换器具有同等体积的接触凸块的共面阵列
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Application No.: US13247174Application Date: 2011-09-28
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Publication No.: US08546925B2Publication Date: 2013-10-01
- Inventor: Juan A. Herbsommer , Osvaldo J. Lopez , Jonathan A. Noquil , David Jauregui , Mark E. Granahan
- Applicant: Juan A. Herbsommer , Osvaldo J. Lopez , Jonathan A. Noquil , David Jauregui , Mark E. Granahan
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Steven A. Shaw; W. James Brady; Frederick J. Telecky, Jr.
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
A packaged power supply module (100) comprising a chip (110) with a first power field effect transistor (FET) and a second chip (120) with a second FET conductively attached side-by-side onto a conductive carrier (130), the transistors having bond pads of a first area (210) and the carrier having bond pads of a second area (230) smaller than the first area. Conductive bumps (114, 115, 124, 125) attached to the transistor bond pads and conductive bumps (126) attached to the carrier bond pads have equal volume and are coplanar (150), the bumps on the transistor pads having a first height and the bumps on the carrier pads having a second height greater than the first height.
Public/Granted literature
- US20130075893A1 Synchronous Buck Converter Having Coplanar Array of Contact Bumps of Equal Volume Public/Granted day:2013-03-28
Information query
IPC分类:
