Three dimensional integrated circuits with double sided power, coolant, and data features and methods of constructing same are provided. According to some embodiments, an integrated circuit package can generally comprise one or more semiconductor wafers and opposing end substrates. The semiconductor wafers can each have a top exterior surface and a bottom exterior surface. The plurality of semiconductor wafers can form a multi-dimensional wafer stack of die wafers such that adjacent wafers have facing surfaces. Each of the semiconductor wafers can comprise one or more channels formed through the wafers. A portion of the channels can extend generally between the top and bottom exterior surfaces of the semiconductor wafers. A portion of the channels can carry conductors for coupling the wafers and/or coolant for cooling the wafers. The opposing end substrates can be disposed proximate opposing ends of the multi-dimensional stack. The opposing end substrates can be configured to supply power, coolant, and data signals to opposing ends of the multi-dimensional wafer stack. Other embodiments are also claimed and described.