Invention Grant
- Patent Title: Semiconductor packages
- Patent Title (中): 半导体封装
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Application No.: US13485853Application Date: 2012-05-31
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Publication No.: US08546935B2Publication Date: 2013-10-01
- Inventor: Chandra Mouli , Gurtej S. Sandhu
- Applicant: Chandra Mouli , Gurtej S. Sandhu
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: H01L23/34
- IPC: H01L23/34
Abstract:
The invention includes semiconductor packages having grooves within a semiconductor die backside; and includes semiconductor packages utilizing carbon nanostructures (such as, for example, carbon nanotubes) as thermally conductive interface materials. The invention also includes methods of cooling a semiconductor die in which coolant is forced through grooves in a backside of the die, and includes methods of making semiconductor packages.
Public/Granted literature
- US20120235310A1 SEMICONDUCTOR PACKAGES Public/Granted day:2012-09-20
Information query
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