Invention Grant
- Patent Title: RF module including control IC without the aid of a relay pad
- Patent Title (中): RF模块包括控制IC，无需继电器垫
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Application No.: US11618207Application Date: 2006-12-29
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Publication No.: US08546939B2Publication Date: 2013-10-01
- Inventor: Kenji Sasaki , Tomonori Tanoue , Sakae Kikuchi , Toshifumi Makino , Takeshi Sato , Tsutomu Kobori , Yasunari Umemoto , Takashi Kitahara
- Applicant: Kenji Sasaki , Tomonori Tanoue , Sakae Kikuchi , Toshifumi Makino , Takeshi Sato , Tsutomu Kobori , Yasunari Umemoto , Takashi Kitahara
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Mattingly & Malur, PC
- Priority: JP2006-037931 20060215
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L29/66 ; H01L23/52 ; H01L23/48 ; H01L29/40 ; H03F1/00 ; H03F3/14 ; H03F3/04 ; H03F3/68 ; H04B1/06 ; H04B7/00 ; H04B1/28
Abstract:
A technology is provided so that RF modules used for cellular phones etc. can be reduced in size. Over a wiring board constituting an RF module, there are provided a first semiconductor chip in which an amplifier circuit is formed and a second semiconductor chip in which a control circuit for controlling the amplifier circuit is formed. A bonding pad over the second semiconductor chip is connected with a bonding pad over the first semiconductor chip directly by a wire without using a relay pad. In this regard, the bonding pad formed over the first semiconductor chip is not square but rectangular (oblong).
Public/Granted literature
- US20070190962A1 RF MODULE AND MANUFACTURING THE SAME Public/Granted day:2007-08-16
Information query
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