Invention Grant
- Patent Title: Manufacturing method of lead frame substrate and semiconductor apparatus
- Patent Title (中): 引线框架基板和半导体装置的制造方法
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Application No.: US12998099Application Date: 2009-09-29
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Publication No.: US08546940B2Publication Date: 2013-10-01
- Inventor: Susumu Maniwa , Takehito Tsukamoto , Junko Toda
- Applicant: Susumu Maniwa , Takehito Tsukamoto , Junko Toda
- Applicant Address: JP Tokyo
- Assignee: Toppan Printing Co., Ltd.
- Current Assignee: Toppan Printing Co., Ltd.
- Current Assignee Address: JP Tokyo
- Priority: JPP2008-250860 20080929
- International Application: PCT/JP2009/004993 WO 20090929
- International Announcement: WO2010/035509 WO 20100401
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/48 ; H01L29/40
Abstract:
A lead frame substrate, including: a metal plate with a first surface and a second surface; a connection post formed on the first surface; wiring formed on the second surface; and a pre-molding resin layer, in which a thickness of the pre-molding resin layer is the same as a height of the connection post.
Public/Granted literature
- US20110169145A1 MANUFACTURING METHOD OF LEAD FRAME SUBSTRATE AND SEMICONDUCTOR APPARATUS Public/Granted day:2011-07-14
Information query
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