Invention Grant
- Patent Title: Ultrasonic sensor
- Patent Title (中): 超声波传感器
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Application No.: US13049221Application Date: 2011-03-16
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Publication No.: US08546997B2Publication Date: 2013-10-01
- Inventor: Tomoaki Nakamura
- Applicant: Tomoaki Nakamura
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Global IP Counselors, LLP
- Priority: JP2010-063902 20100319; JP2010-287179 20101224
- Main IPC: H01L41/113
- IPC: H01L41/113

Abstract:
An ultrasonic sensor includes a support body having an opening, a support film closing the opening, a piezoelectric body disposed on the support film in an inner region of the opening in a plan view, a first resin material forming a first space closed off from an outside space between the first resin material and the support film in at least a region in which the opening is formed in the plan view and the first resin material having an contacting portion facing the opening and being configured to contact with a test object, a second resin material forming a second space closed off from the outside space and communicating with the first space, and an ultrasonic wave transmitting medium filling the first and second spaces. A flexible portion having lower rigidity than the support film in the film thickness direction is provided in a portion of the second resin material.
Public/Granted literature
- US20110227449A1 ULTRASONIC SENSOR Public/Granted day:2011-09-22
Information query
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