Invention Grant
- Patent Title: Test apparatus and test module
- Patent Title (中): 测试仪器和测试模块
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Application No.: US12694149Application Date: 2010-01-26
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Publication No.: US08547125B2Publication Date: 2013-10-01
- Inventor: Tadashi Morita , Tetsuya Koishi , Takeshi Yaguchi
- Applicant: Tadashi Morita , Tetsuya Koishi , Takeshi Yaguchi
- Applicant Address: JP Tokyo
- Assignee: Advantest Corporation
- Current Assignee: Advantest Corporation
- Current Assignee Address: JP Tokyo
- Main IPC: G01R31/3187
- IPC: G01R31/3187

Abstract:
Provided is a test apparatus for testing at least one device under test, including: a test module that includes a plurality of test sections, the plurality of test sections testing the device under test by exchanging signals with the device under test; and a plurality of test control sections that control the plurality of test sections, where the test module includes the plurality of test sections; a setting storage section that stores setting as to which of the plurality of test control sections should be associated with each of the plurality of test sections; and an interface section that is connected to the plurality of test sections, provides an access request issued from one of the plurality of test control sections and directed to the test module, to a test section associated with the test control section, and is able to set, independently for each of the plurality of test sections, which of the plurality of test control sections should control the test section.
Public/Granted literature
- US20110181309A1 TEST APPARATUS AND TEST MODULE Public/Granted day:2011-07-28
Information query
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