The disclosure relates to a printed circuit board (PCB) for an electronic circuit for a power amplifier of a wireless communication device. The PCB comprises: a substrate; a ground reference in the substrate; first through fourth locations and first and second pads in the substrate; and first and second electrical tracks in the substrate. The locations are for components for the PCB, including a 0 ohm component, and pads connect tracks to the components. The first pad is for a high band power input terminal of the amplifier. The first track connects the first pad to the second location. The third location is in the first track for placement of a first capacitor in a circuit between the first pad and ground. The second pad is for an output terminal of the amplifier. The second track connects the second pad to an output stage circuit of the amplifier.