Invention Grant
- Patent Title: High-frequency coupler and communication device
- Patent Title (中): 高频耦合器和通讯装置
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Application No.: US13039863Application Date: 2011-03-03
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Publication No.: US08547184B2Publication Date: 2013-10-01
- Inventor: Takanori Washiro
- Applicant: Takanori Washiro
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Wolf, Greenfield & Sacks, P.C.
- Priority: JP2010-056561 20100312
- Main IPC: H01P5/04
- IPC: H01P5/04 ; H01Q9/26

Abstract:
A high-frequency coupler includes a ground, a coupling electrode which faces the ground and is supported so as to be separated by a negligible height with respect to a high-frequency signal, a resonating unit for increasing a current flowing into the coupling electrode, a supporting unit which is connected to the resonating unit, and a short-circuiting unit which short-circuits the tip portions of the coupling electrode, in which an infinitesimal dipole constituted by a line connecting the center of the charges accumulated in the coupling electrode and the center of mirror-image charges accumulated in the ground is formed, and the high-frequency signal is transmitted toward a high-frequency coupler of a communication partner so that the angle θ formed in the direction of the infinitesimal dipole is substantially 0 degrees.
Public/Granted literature
- US20110222586A1 HIGH-FREQUENCY COUPLER AND COMMUNICATION DEVICE Public/Granted day:2011-09-15
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