Several embodiments of photolithography systems and associated methods of selective die exposure are disclosed herein. In one embodiment, a method for exposing a microelectronic substrate in a photolithography system includes producing an illumination radiation from a radiation source and identifying a field on the microelectronic substrate to be exposed. The field is partitioned into a first region discrete from a second region. The method further includes inhibiting the illumination radiation to expose the first region while simultaneously exposing the second region to the illumination radiation.