Invention Grant
- Patent Title: Final defect inspection system
- Patent Title (中): 最终缺陷检查系统
-
Application No.: US13721019Application Date: 2012-12-20
-
Publication No.: US08547548B1Publication Date: 2013-10-01
- Inventor: Chia-Chi Lo , Cheng-Hsiung Yang Yang , Jun-Chung Hsu
- Applicant: Kinsus Interconnect Technology Corp.
- Applicant Address: TW Taoyuan
- Assignee: Kinsus Interconnect Technology Corp.
- Current Assignee: Kinsus Interconnect Technology Corp.
- Current Assignee Address: TW Taoyuan
- Main IPC: G01N21/00
- IPC: G01N21/00

Abstract:
Disclosed is a final defect inspection system, which including a host device, a microscope, a bar code scanner, a support tool, a signal transceiver and an electromagnetic pen. The bar code scanner scans a bar code on a circuit board provided on the support plate. The host device selects data and a circuit layout diagram from the database corresponding to the bar code. The signal transceiver and the electromagnetic pen are electrically connected to the host device. The electromagnetic pen is used to make a mark on a scrap region of the circuit board where any defect is visually found through the microscope. The signal transceiver receives and transmits the positions of the mark to the host device such that the host device calculates the coordinate of a scrap region based on a relative position between an original point and the positions of the mark.
Information query