Invention Grant
- Patent Title: Suspension board with circuit having an electrically conductive layer interposed between a support terminal and metal plating layer
- Patent Title (中): 具有插入在支撑端子和金属电镀层之间的导电层的电路的悬挂板
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Application No.: US13317599Application Date: 2011-10-24
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Publication No.: US08547663B2Publication Date: 2013-10-01
- Inventor: Yuu Sugimoto
- Applicant: Yuu Sugimoto
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Edwards Neils PLLC
- Agent Jean C. Edwards, Esq.
- Priority: JP2010-251655 20101110
- Main IPC: G11B5/48
- IPC: G11B5/48 ; H05K1/09
Abstract:
A suspension board with circuit includes a metal supporting board; an insulating layer formed on the metal supporting board having an opening penetrating in the thickness direction formed therein; and a conductive pattern formed on the insulating layer including an external-side terminal electrically connected to an external board. The external-side terminal is filled in the opening of the insulating layer. In the metal supporting board, a support terminal electrically insulated from the surrounding metal supporting board and electrically connected to the external-side terminal is provided. The suspension board with circuit includes a metal plating layer formed below the support terminal and an electrically-conductive layer interposed between the support terminal and the metal plating layer having a thickness of 10 nm or more to 200 nm or less.
Public/Granted literature
- US20120113547A1 Suspension board with circuit and producing method thereof Public/Granted day:2012-05-10
Information query
IPC分类:
