Invention Grant
- Patent Title: Power semiconductor device adaptive cooling assembly
- Patent Title (中): 功率半导体器件自适应冷却组件
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Application No.: US13122807Application Date: 2009-10-01
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Publication No.: US08547687B2Publication Date: 2013-10-01
- Inventor: Alexander Christiaan De Rijck , Hendrik Huisman
- Applicant: Alexander Christiaan De Rijck , Hendrik Huisman
- Applicant Address: NL Eindhoven
- Assignee: Koninklijke Philips N.V.
- Current Assignee: Koninklijke Philips N.V.
- Current Assignee Address: NL Eindhoven
- Priority: EP08165960 20081007
- International Application: PCT/IB2009/054301 WO 20091001
- International Announcement: WO2010/041175 WO 20100415
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
The invention relates to a power semiconductor device (100) cooling assembly for cooling a power semiconductor device (100), wherein the assembly comprises an actively cooled heat sink (102) and a controller (208; 300), wherein the controller (208; 300) is adapted for adjusting the cooling efficiency of the heat sink (102) depending on the temperature of the high current carrying semiconductor junction comprised in the power semiconductor device (100).
Public/Granted literature
- US20110194256A1 POWER SEMICONDUCTOR DEVICE ADAPTIVE COOLING ASSEMBLY Public/Granted day:2011-08-11
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