Invention Grant
- Patent Title: Electronic component, board unit, and information-processing device
- Patent Title (中): 电子元件，板单元和信息处理设备
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Application No.: US12873702Application Date: 2010-09-01
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Publication No.: US08547706B2Publication Date: 2013-10-01
- Inventor: Hiroaki Tamura , Fumihiko Tokura , Michinao Nomura , Toshihiro Kusagaya , Kazuhiro Mizukami
- Applicant: Hiroaki Tamura , Fumihiko Tokura , Michinao Nomura , Toshihiro Kusagaya , Kazuhiro Mizukami
- Applicant Address: JP Kawasaki JP Tokyo
- Assignee: Fujitsu Limited,Fujitsu Component Limited
- Current Assignee: Fujitsu Limited,Fujitsu Component Limited
- Current Assignee Address: JP Kawasaki JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2009-228371 20090930
- Main IPC: H04L9/00
- IPC: H04L9/00
Abstract:
An electronic component includes: an electronic component body; and a lead secured to the electric component and including a projection portion defined by first and second inclined portions facing each other. The solder wettability of the first inclined portion is smaller than the solder wettability of the second inclined portion.
Public/Granted literature
- US20110075386A1 ELECTRONIC COMPONENT, BOARD UNIT, AND INFORMATION-PROCESSING DEVICE Public/Granted day:2011-03-31
Information query
