Invention Grant
- Patent Title: Apparatus and method for improved control of heating and cooling of substrates
- Patent Title (中): 改善基板加热和冷却控制的装置和方法
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Application No.: US12576711Application Date: 2009-10-09
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Publication No.: US08548311B2Publication Date: 2013-10-01
- Inventor: Blake R. Koelmel , Norman L. Tam , Joseph M. Ranish
- Applicant: Blake R. Koelmel , Norman L. Tam , Joseph M. Ranish
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Servilla Whitney LLC
- Main IPC: F21V9/00
- IPC: F21V9/00 ; F26B19/00
Abstract:
Methods and apparatus for processing substrates and controlling the heating and cooling of substrates are described. A radiation source providing radiation in a first range of wavelengths heats the substrate within a predetermined temperature range, the substrate being absorptive of radiation in a second range of wavelengths within the first range of wavelengths and within the predetermined temperature range. A filter prevents at least a portion of radiation within the second wavelength range from reaching the substrate.
Public/Granted literature
- US20100074604A1 Apparatus and Method for Improved Control of Heating and Cooling of Substrates Public/Granted day:2010-03-25
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