Invention Grant
US08548543B2 Symmetrically packaged optical sensors for implantable medical devices 有权
用于可植入医疗器械的对称封装光学传感器

  • Patent Title: Symmetrically packaged optical sensors for implantable medical devices
  • Patent Title (中): 用于可植入医疗器械的对称封装光学传感器
  • Application No.: US12915984
    Application Date: 2010-10-29
  • Publication No.: US08548543B2
    Publication Date: 2013-10-01
  • Inventor: Can CinbisJonathan L. Kuhn
  • Applicant: Can CinbisJonathan L. Kuhn
  • Applicant Address: US MN Minneapolis
  • Assignee: Medtronic, Inc.
  • Current Assignee: Medtronic, Inc.
  • Current Assignee Address: US MN Minneapolis
  • Agent Evans M. Mburu
  • Main IPC: A61B5/1455
  • IPC: A61B5/1455
Symmetrically packaged optical sensors for implantable medical devices
Abstract:
Implantable medical devices and methods include an optical sensor that includes at least two optical sensor portions. The light emitting devices of the optical sensor are distributed among the at least two optical sensor portions.
Information query
Patent Agency Ranking
0/0