Invention Grant
- Patent Title: Method for forming a package and a package
- Patent Title (中): 用于形成包装和包装的方法
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Application No.: US12808112Application Date: 2008-12-11
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Publication No.: US08549721B2Publication Date: 2013-10-08
- Inventor: Heli Vesanto , Jalliina Jarvinen , Niilo Poyhonen , Teemu Karhu , Paivi Maatta , Juhani Nylander
- Applicant: Heli Vesanto , Jalliina Jarvinen , Niilo Poyhonen , Teemu Karhu , Paivi Maatta , Juhani Nylander
- Applicant Address: FI Helsinki
- Assignee: Stora Enso Oyj
- Current Assignee: Stora Enso Oyj
- Current Assignee Address: FI Helsinki
- Agency: Birch, Stewart, Kolasch & Brich, LLP
- Priority: FI20070973 20071212
- International Application: PCT/FI2008/050729 WO 20081211
- International Announcement: WO2009/074721 WO 20090618
- Main IPC: B23P25/00
- IPC: B23P25/00 ; B65D1/00 ; B31B1/00

Abstract:
In a method for forming a package, a package with the shape of a container is formed of a cardboard blank, the package having a bottom and side walls extending upwards from the bottom. At the end stage of compression molding, a rim of molding material extending sideways is molded to the upper part of the side walls when the mold is kept closed in such a way that a mold cavity corresponding to the rim is formed by moving a counter surface inside the mold backwards from a surface opposite to it, after which the molding material is introduced into the mold cavity.
Public/Granted literature
- US20100264203A1 METHOD FOR FORMING A PACKAGE AND A PACKAGE Public/Granted day:2010-10-21
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