Invention Grant
US08549743B2 Method for hot embossing at least one conductive track onto a substrate
失效
将至少一个导电轨迹热压花到基底上的方法
- Patent Title: Method for hot embossing at least one conductive track onto a substrate
- Patent Title (中): 将至少一个导电轨迹热压花到基底上的方法
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Application No.: US12733487Application Date: 2008-07-08
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Publication No.: US08549743B2Publication Date: 2013-10-08
- Inventor: Ricardo Ehrenpfordt , Johanna May
- Applicant: Ricardo Ehrenpfordt , Johanna May
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Kenyon & Kenyon LLP
- Priority: DE102007042411 20070906
- International Application: PCT/EP2008/058818 WO 20080708
- International Announcement: WO2009/033842 WO 20090319
- Main IPC: H05K3/02
- IPC: H05K3/02
Abstract:
In a method for hot embossing at least one conductor track onto a substrate, a film having at least one electrically conductive layer is pressed against the substrate in a die direction using an embossing die having a structured die surface. The film remains on the substrate after ending the embossing process in at least two structure planes, which are spaced apart in the die direction.
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