Invention Grant
- Patent Title: Method of manufacturing liquid discharge head substrate and method of processing the substrate
- Patent Title (中): 液体排出头基板的制造方法及其处理方法
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Application No.: US12990093Application Date: 2009-06-17
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Publication No.: US08549750B2Publication Date: 2013-10-08
- Inventor: Masataka Kato , Keisuke Kishimoto
- Applicant: Masataka Kato , Keisuke Kishimoto
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2008-160306 20080619
- International Application: PCT/JP2009/002758 WO 20090617
- International Announcement: WO2009/153987 WO 20091223
- Main IPC: B21D53/76
- IPC: B21D53/76 ; B23P17/00 ; B41J2/15 ; B41J2/145
Abstract:
A method of processing a liquid discharge head substrate includes the step of providing a recessed portion in the back surface of the substrate by discharging a manufacturing liquid in a linear trajectory to the back surface of the substrate and by irradiating the back surface of the substrate with laser light that passes along and in the manufacturing liquid.
Public/Granted literature
- US20110041337A1 METHOD OF MANUFACTURING LIQUID DISCHARGE HEAD SUBSTRATE AND METHOD OF PROCESSING THE SUBSTRATE Public/Granted day:2011-02-24
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